MA4P7452F-1072T
PIN Diode
The MA4P7452F-1072T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Leadless Faced (MELF) package. The device incorporates MACOM's time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. Incorporated in the package is a hard glass passivated, CERMACHIP™ PIN chip that is full face bonded on both the cathode and anode to maximize surface area for the lowest electrical and thermal resistance. The package utilizes a non-magnetic plating process that provides for a package with extremely low permeability. The MA4P7452F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The non-magnetic MA4P7452F-1072T is the electrical equivalent of its magnetic counterpart the MA4P7002F-1072T. This diode is well suited for use in low loss, low distortion, high power switching circuits and can be used in high magnetic field environments at HF through UHF frequencies. The low thermal resistance of this device provides excellent performance at high RF power incident levels, up to 100 watts CW. This device is designed to meet the most demanding electrical and mechanical MRI environments.
Product Specifications
- Part Number
- MA4P7452F-1072T
- Description
- PIN Diode
- Breakdown Voltage, Minimum(V)
- 150
- Resistance(Ohm)
- 0.90
- Total Capacitance(pF)
- 0.700
- Lifetime(nS)
- 9000
- CW Power Dissipation(W)
- 10.0
- Thermal Resistance(°C/W)
- 15.0
- Package
- ODS-1072
- Package Category
- Ceramic Surface Mount
- Min Frequency(MHz)
- 0
- Max Frequency(MHz)
- 1500
Features
- Non-Magnetic Package Suitable for MRI Applications
- RoHS Compliant
- High Average Incident Power Handling
- Low Cj for High Series Isolation
- Long tL for Lower Intermodulation Distortion
- Low Rs for Low Series Loss
- Hermetically Sealed
- Rectangular MELF SMQ Ceramic Package
Applications
- Aerospace and Defense
- ISM