MA4P404-132
PIN Diode
MACOM's offers a comprehensive line of low capacitance, planar and mesa, silicon PIN diode chips which use ceramic glass and silicon nitride passivation technology. The Silicon PIN Chip series of devices cover a broad spectrum of performance requirements for control circuit applications. They are available in several choices of I-region lengths and have been optimally designed to minimize parametric trade offs when considering low capacitance, low series resistance, and high breakdown voltages. Their small size and low parasitics, make them an ideal choice for broadband, high frequency, micro-strip hybrid assemblies. The attenuator line of PIN diode chips are a planar or mesa construction and because of their thicker I-regions and predictable Rs vs. I characteristics, they are well suited for low distortion attenuator and switch circuits. Incorporated in the chip’s construction is MACOM's, time proven, hard glass, CERMACHIP® . The hard glass passivation completely encapsulates the entire PIN junction area resulting in a hermetically sealed chip which has been qualified in many military applications. These CERMACHIP® diodes are available in a wide range of voltages, up to 3,000 volts, which are capable of controlling kilowatts of RF power.
Product Specifications
- Part Number
- MA4P404-132
- Description
- PIN Diode
- Breakdown Voltage, Minimum(V)
- 250
- Resistance(Ohm)
- 0.70
- Total Capacitance(pF)
- 0.200
- Lifetime(nS)
- 600
- CW Power Dissipation(W)
- 7.5
- Thermal Resistance(°C/W)
- 20.0
- Package
- ODS-132 Die
- Package Category
- Surface Mount Die
- ROHS
- Yes
- Min Frequency(MHz)
- 5
- Max Frequency(MHz)
- 10000
Features
- Switch & Attenuator Die
- High Isolation
- Low Loss
- Fast Switching Speed
- Voltage Ratings to 3000V
- Glass Passivated CERMACHIP®
- Hermetic
- Extensive Selection of I-Region Lengths
- Oxide Passivated Planar Chips
- RoHS Compliant
Technical Resources
Datasheet
Model Data (Sparameters)
Application Notes
- S-Parameter S2P File Format Guide
- Known Good Die Delivery Specification
- Bonding, Handling, and Mounting Procedures for Chip Diode Devices
- Design with PIN Diodes
- Establishing the Minimum Reverse Bias for a PIN Diode in a High-Power Switch
- Using the DR65-0109 (DR65-0003 replacement part) to Drive SPDT PIN Switches