2, 3.5 and 5 dB Gain Equalizer Array, 2 to 18 GHz

The ENGEQ00134 is a die with three gain equalizers. The part is ideal for select at test applications. The signal path is selected by wire bond connections to the bond pads associated for 2, 3.5 or 5 dB gain slope, while maintaining good impedance match to 50 Ohms. The die has a gold backside metallization and is designed to be silver epoxy attached. The RF interconnects are designed to account for wire bonds and external microstrip flares for optimal integrated return loss. Nichrome resistors with low temperature coefficients are set up to handle up to 100 milliwatts RF input power levels.