CGY2330UH

6-Bit, Ku-Band Core Chip

The CGY2330UH/C1 is a high-performance GaAs pHEMT MMIC 6-bit Core Chip designed to operate in the Ku-band. The die is manufactured using a 180 nm gate length pHEMT technology (ED02AH). This technology has been evaluated for space applications and is on European preferred parts list of the European Space Agency (ESA). The pad metallization is gold over titanium/platinum and compatible with ultrasonic wire bonding. The minimum gold thickness shall be 1.25 μm.

Product Specifications

Part Number
CGY2330UH
Description
6-Bit, Ku-Band Core Chip
Min Frequency(GHz)
13
Max Frequency(GHz)
15
Package
DIE

Features

  • Gain: 5.5 dB
  • Drain Voltage Supply: 3 V
  • Drain Current: 16 mA
  • 50 Ω Input & Output Matched
  • Chip Size: 5.85 x 1.5 mm
  • Tested, Inspected Known Good Die (KGD)
  • Space and MIL-STD MMICs
  • RoHS* Compliant

Technical Resources

Datasheet


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CGY2330UH
6-Bit, Ku-Band Core Chip