MA4SPS421

Surmount PIN Diode

This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC(TM) process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These surmount devices are suitable for usage in moderate incident power (10W C.W.) or higher incident peak power (500W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.1 to 0.2nH, and excellent RC constant (0.45pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts.

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Product Specifications

Part Number: MA4SPS421
Description: Surmount PIN Diode
Breakdown Voltage, Minimum(V): 200
Resistance(Ohm): 6.20
Total Capacitance(pF): 0.130
Lifetime(nS): 5000
CW Power Dissipation(W): 1.8
Package: Surmount Die
Package Category: Surface Mount Die
ROHS: Yes
Min Frequency(MHz): 50
Max Frequency(MHz): 6000

Technical Resources

Datasheet

MA4SPS420 Series.pdf

Application Notes

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MA4SPS421

Diode,Silicon-Glass,PIN,Chip

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MADP-000421-12940P

Diode,PIN,Surmout,PocketTape

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